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Special Reports

 

Special Reports Rubric : control technology
 

Rubrics : gas analytics - liquid analytics - physical parameter - auxiliary units
Solutions for process analytics - complete solutions from one source.


At Interpack 2017 hall 8a, booth A03, SICK will present itself as a supplier of a comprehensive range of high-tech solutions for the packaging industry.

Waldkirch, November 2016

Quality is not a vision

The products, systems and services that it puts on display will include compact, easily integrated devices, configurable stand-alone solutions and programmable high-speed cameras.

 


At Interpack 2017,
SICK will present itself as the supplier of a wide range of sensors for the consumer goods industry. As well as individual components, the sensor manufacturer offers a comprehensive portfolio of technological solutions to meet individual customers' requirements.

SICK will focusi n particular on quality assurance
at Interpack. The fast throughput speeds and short cycle times of production lines and machines in the packaging industry allow for high productivity. However, this can only be achieved if a comprehensive quality control system is in place.

SICK will present new solutions
consisting of its own modules and integrable functions from image processing libraries that offer intelligent support for the packaging industry in areas such as quality assurance, traceability, object data acquisition and preventive maintenance.

A 3D inspection system is the ideal solution in this area. It can reliably identify faulty product features, incomplete packaging units and inadequate labeling. The data and measurements produced by the vision sensors and their integration into real-time fieldbus environments enable them to provide valuable information that can be used in today's manufacturing plants and in the smart factories of the future.

The vision sensors have the necessary intelligent detection, measurement, assessment and communication functions to allow for
future-proof process and quality controls in the context of Industry 4.0.


Press release

 

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